News
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Oferta de beca – INDRA Torrejón
31 Oct 2024
Fecha 31/10/2024 – incorporación inmediata Departamento: Radar Secundario / IFF. Desarrolla equipos de identificación AMIGO/ENEMIGO para evitar el fratricidio. Son equipos embarcados en plataformas de ámbito militar. Descripción de la beca: Los candidatos seleccionados conocerán la arquitectura interna de los … Read more
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XVI CEI Annual Meeting. CHALLENGES IN MICROELECTRONIC DESIGN
26 Apr 2024
The XVI CEI Annual Meeting will take place in the ETSII-UPM on May 9th-10th, 2024. As in previous years, the main objective of this event is to present the CEI activities related to both industrial and academic partners. Thus, the … Read more
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Concesión provisional de una cátedra PERTE Chip a la UPM
29 Feb 2024
El Ministerio de Asuntos Económicos y Transformación Digital lanzó en el verano de 2023 una convocatoria de ayudas destinada a financiar la creación de Cátedras Universidad-Empresa en el periodo 2023-2027 cuya actividad esté centrada en la investigación, la difusión y … Read more
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Events
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XVI CEI Annual Meeting. CHALLENGES IN MICROELECTRONIC DESIGN
26 Apr 2024
The XVI CEI Annual Meeting will take place in the ETSII-UPM on May 9th-10th, 2024. As in previous years, the main objective of this event is to present the CEI activities related to both industrial and academic partners. Thus, the … Read more
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XIV AM. Short Courses
1 Jun 2022
COURSE 1. Building custom RISC-V Systems on Chip with open-source tools Coordinators: Alfonso Rodríguez & Andrés Otero Summary: Chipyard is an open-source framework for custom SoC generation developed at UC Berkeley. One of its main characteristics is that it enables … Read more
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Oferta para tesis doctoral/PhD positionin in “Internet of Things Edge Computing and Interoperable Communication Technologies for Industry 4.0”
19 Feb 2021
The goal of this PhD is therefore to research on novel middleware capabilities and interoperable communication mechanisms based on open and standardized technologies for the edge of the IoT, to create seamless integration among networked multi-sensing platforms and upper abstraction levels within the Industry 4.0 context, and in particular for the circular manufacturing ecosystem of KYKLOS 4.0 H2020 project. Read more
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